发明名称 Method of manufacturing a semiconductor device
摘要 A method of manufacturing a semiconductor device, comprises the steps of: forming an amorphous silicon film on a substrate having an insulating surface; processing said amorphous silicon film by plasma of a gas that mainly contains hydrogen or helium; and giving an energy to said amorphous silicon film.
申请公布号 US5956581(A) 申请公布日期 1999.09.21
申请号 US19960616623 申请日期 1996.03.15
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YAMAZAKI, SHUNPEI;TERAMOTO, SATOSHI;KUSUMOTO, NAOTO;OHNUMA, HIDETO
分类号 H01L21/20;H01L21/30;H01L21/336;H01L21/77;H01L21/84;(IPC1-7):H01L21/324 主分类号 H01L21/20
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