发明名称 Halogen-free flame-retardant epoxy resin composition as well as prepreg and laminate containing the same
摘要 PCT No. PCT/JP95/01988 Sec. 371 Date May 28, 1997 Sec. 102(e) Date May 28, 1997 PCT Filed Sep. 29, 1995 PCT Pub. No. WO97/12925 PCT Pub. Date Apr. 10, 1997Disclosed in a halogen-free flame-retardant epoxy resin composition, comprising (A) a bisphenol A type epoxy resin, (B) a novolak type epoxy resin, (C) a phenolic resin type curing agent, (D) a curing accelerator, and (E) an inorganic filler. The phenolic resin type curing agent (C) is provided by a nitrogen-containing phenolic resin, preferably, by a co-condensation resin formed by the reaction among a phenolic compound, a guanamine compound, and an aldehyde compound. More desirably, a phenolic resin containing both phosphorus and nitrogen should be used as the curing agent (C). Further, a combination of the co-condensation resin noted above (C-1) and a reactive phosphoric acid ester can be used as a curing agent.
申请公布号 US5955184(A) 申请公布日期 1999.09.21
申请号 US19970849179 申请日期 1997.05.28
申请人 TOSHIBA CHEMICAL CORPORATION 发明人 HONDA, NOBUYUKI;SUGIYAMA, TSUYOSHI;SUZUKI, TETSUAKI
分类号 C08G14/06;C08G59/38;C08G59/40;C08L61/14;C08L61/26;C08L61/34;C08L63/00;H01L23/14;H01L23/29;H05K1/03;(IPC1-7):B32B7/00 主分类号 C08G14/06
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