发明名称 WIRE SAW CUTTER DEVICE
摘要 PROBLEM TO BE SOLVED: To operate a wire saw cutter device under a stable condition, by eliminating abnormal tension applied to a wire. SOLUTION: An ingot 9 is sliced by a wire turned around group rollers 1, 2, and a wafer is cut out. An abnormal tension absorbing mechanism 20 provided between the group rollers 1, 2 and in-coming/ out-going side deflector rollers 18 is provided with a damper roller 21 with a peripheral surface into contact with a wire running route, a frame of the damper roller 21 is connected to a piston of a directional valve 24. At generation time of abnormal tension, when the tension given to the wire rapidly rises, the damper roller 21 is made to instantaneously take refuge from the wire running route, the abnormal tension is eliminated by loosening the wire 5. In this way, the wire is prevented from breaking by abnormal tension easily generated at switching time or the like of a running direction of the wire, and wire saw cutting is continued under a stable condition.
申请公布号 JPH11254287(A) 申请公布日期 1999.09.21
申请号 JP19980062952 申请日期 1998.03.13
申请人 SUPER SILICON KENKYUSHO:KK 发明人 OISHI HIROSHI;ASAKAWA KEIICHIRO;MATSUZAKI JUNICHI
分类号 B24B27/06;B23D57/00;H01L21/304;(IPC1-7):B24B27/06 主分类号 B24B27/06
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