发明名称 POLISHING METHOD AND POLISHING DEVICE FOR LAYERED PLATE MOLDING PLATE
摘要 PROBLEM TO BE SOLVED: To prevent a surface layer of a plate from being removed, in an end part of the layered plate molding plate. SOLUTION: In a polishing method of a layered plate molding plate 10, it is polished by a buff roller 1 by supplying the layered plate molding plate 10 between the buff roller 1 and a backup roller 2. The point of time a front/ rear end of the layered plate molding plate 10 leads to a reference position set to before the buff roller 1 is detected by a sensor 4. Length of a moving distance of the layered plate molding plate 10 is measured by a rotary encoder 3. Contact timing of the backup roller 2 with the layered plate molding plate 10 is controlled, based on a measurement result by the sensor 4 and the rotary encoder 3 so as to prevent pressing force by the backup roller 2 from acting in an end part of the layered plate molding plate 10.
申请公布号 JPH11254290(A) 申请公布日期 1999.09.21
申请号 JP19980063715 申请日期 1998.03.13
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 FURUKAWA MITSUO
分类号 B24B29/00;H05K3/26;(IPC1-7):B24B29/00 主分类号 B24B29/00
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