发明名称 FILM FORMING METHOD AND FILM FORMING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide technique capable of efficiently providing a high-quality film. SOLUTION: This material to form a Cu-based film has two or more units of coordinated bonds of univalent metal Cu-andβ-diketone in one molecule and has stabilized ligands having coordinated bonds with the univalent metal Cu. The stabilized ligands are selected from the group expressed by formula. In the formula, each of R<1> , R<2> , R<3> , R<4> , R<5> , R<6> , R<7> , R<8> is either selected from the group of a hydrogen atom, 1-10C alkyl group, 1-10C alkene group, 1-10C alkyne group, 1-10C aryl group, 1-10C substd. aryl group, 1-10C alkyl group containing Si, 1-10C alkene group containing Si, 1-10C alkyne group containing Si, 1-10C aryl group containing Si and 1-10C substd. aryl group containing Si, R<1> , R<2> , R<3> , R<4> , R<5> , R<6> , R<7> , R<8> may be same or different and l, m are integers of 0 to 10.
申请公布号 JPH11256330(A) 申请公布日期 1999.09.21
申请号 JP19980055179 申请日期 1998.03.06
申请人 TORI CHEMICAL KENKYUSHO:KK 发明人 MACHIDA HIDEAKI;KOKUBU HIROSHI
分类号 C23C16/18;(IPC1-7):C23C16/18 主分类号 C23C16/18
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