发明名称 BONDING METHOD OF TIP OF RESIN FILM TO LAMINATED METAL BAND
摘要 <p>PROBLEM TO BE SOLVED: To better the yield and reduce the production cost by a method wherein the tip of a resin film is inserted between a laminated metal band under running and a laminating rolls so as to fix the tip of the resin film under heat and pressure to the surface of the laminated metal band. SOLUTION: The tip part of a resin film 4 is guided to a pinch roll 7 contactingly arranged on the inlet side of laminating rolls 3. Next, by being fitten between the pinch roll 7 and the laminating roll 3, a tension is generated at the tip part of the resin film 4 between a guide roll 5 and the pinch roll 7 and the resin film 4 is released from a suction belt conveyor 6. After that, through the rotations of the pinch roll 7 and the laminating roll 3, the tip part of the resin film 4 is inserted between a laminated metal band 1 under running on the inlet side of the laminating roll 3 and the laminating roll 3 so as to be fixed onto the surface of the laminated metal band 1 under heat and pressure. Thus, since a resin film laminated metal band product is produced through the automatic fixing of the resin film to the metal band, the length of the product scrapped as a non-conforming one is reduced.</p>
申请公布号 JPH11254630(A) 申请公布日期 1999.09.21
申请号 JP19980059855 申请日期 1998.03.11
申请人 NIPPON STEEL CORP 发明人 HONDA OSAMU;SENDA TOSHIO;NISHIZAWA KOICHI
分类号 B32B37/20;B32B15/08;(IPC1-7):B32B31/08 主分类号 B32B37/20
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