| 摘要 |
PROBLEM TO BE SOLVED: To prepare a grinding slurry that is used in a chemical and mechanical grinding step for solving the level difference on a processed face in the production process for semiconductor devices, and provide a grinding method using the same. SOLUTION: This grinding slurry 31 comprises abrasive grains and at least one selected from fatty acids and fatty acid esters. The fatty acid is selected from oleic acid, myristic acid and stearic acid and the fatty acid ester is at least one selected from butyl stearate and heptyl oleate. The grinding slurry 31 is used in a grinding method in which a face to be ground of a substrate, for example, a wafer 10, is brought into contact with the grinding face of a grinding plate 21 fixed to a grinding disk 22. |
