| 摘要 |
An electrical interconnect structure, including a first component (300), a second component (320), and an electrical interconnect electrically and mechanically interconnecting the first component to the second component, the electrical interconnect including a first solder sphere (314) and a second solder sphere (318) stacked on each other. A semiconductor die (200, 100) that is bumped and packaged utilizing the electrical interconnect structure is also disclosed.
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