Chip support arrangement and chip support for the manufacture of a chip casing

摘要

PCT No. PCT/DE95/01780 Sec. 371 Date Jun. 25, 1997 Sec. 102(e) Date Jun. 25, 1997 PCT Filed Dec. 7, 1995 PCT Pub. No. WO96/21947 PCT Pub. Date Jul. 18, 1997Chip-support arrangement (23) with a chip support (23) for the manufacture of a chip casing, said chip support being provided on a support foil (20) with conducting paths (21) which are connected on the front side of the support foil facing a chip (39) to contact-surface metallizations (40) of the chip and which with their free ends form a connection-surface arrangement (42) distributed in planar manner for the purpose of connection to an electronic component or a substrate, whereby the conducting paths (21) are arranged on the reverse side of the support foil (20), recesses (28) in the support foil (20) are provided in the region of the contact-surface metallizations (40), the conducting paths for forming the connection-surface arrangement (42) are covered with a perforated mask (36) and the thickness (s) of the support foil is smaller than or substantially equal to the height (h) of the contact-surface metallizations (40) on the surface of the chip.