发明名称 Tungsten-copper composite powder
摘要 A high performance W-Cu composite powder which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten-coated copper composite powder may be pressed and sintered into W-Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.
申请公布号 US5956560(A) 申请公布日期 1999.09.21
申请号 US19970784159 申请日期 1997.01.15
申请人 OSRAM SYLVANIA INC. 发明人 DORFMAN, LEONID P.;HOUCK, DAVID L.;SCHEITHAUER, MICHAEL J.;PALIWAL, MUKTESH;MEYERS, GAIL T.;VENSKYTIS, FRANK J.
分类号 B22F1/00;B22F1/02;B22F9/22;C01G41/00;C04B41/51;C04B41/88;C22C1/04;H01H1/025;H01L23/498;H05K1/09;(IPC1-7):B22F1/02 主分类号 B22F1/00
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