发明名称 |
Tungsten-copper composite powder |
摘要 |
A high performance W-Cu composite powder which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten-coated copper composite powder may be pressed and sintered into W-Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.
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申请公布号 |
US5956560(A) |
申请公布日期 |
1999.09.21 |
申请号 |
US19970784159 |
申请日期 |
1997.01.15 |
申请人 |
OSRAM SYLVANIA INC. |
发明人 |
DORFMAN, LEONID P.;HOUCK, DAVID L.;SCHEITHAUER, MICHAEL J.;PALIWAL, MUKTESH;MEYERS, GAIL T.;VENSKYTIS, FRANK J. |
分类号 |
B22F1/00;B22F1/02;B22F9/22;C01G41/00;C04B41/51;C04B41/88;C22C1/04;H01H1/025;H01L23/498;H05K1/09;(IPC1-7):B22F1/02 |
主分类号 |
B22F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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