Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric

摘要

The present invention provides reinforced laminates for printed circuit boards having a woven reinforcement fabric of a yarn including E-glass fibers having a coating which is compatible with the polymeric matrix material. The yarn has a loss on ignition ranging from about 0.01 to about 0.6 weight percent and an Air Jet Transport Drag Force of greater than about one gram force per gram mass of yarn evaluated using a needle air jet nozzle unit having an internal air jet chamber having a diameter of 2 millimeters and a nozzle exit tube having a length of 20 centimeters at a yarn feed rate of about 274 meters (about 300 yards) per minute and an air pressure of about 310 kiloPascals (about 45 pounds per square inch) gauge. The laminate has a flexural strength in the fill direction of the fabric greater than about 3 x 10<7> kilograms per square meter (about 42.7 kpsi). The yarn coating can include polyester and a polymer selected from vinyl pyrrolidone polymers, vinyl alcohol polymers, starches and mixtures thereof. Alternatively, the laminate has a coefficient of thermal expansion in the z-direction of less than about 4.5 percent at a temperature of 288 DEG C.