| 摘要 |
<p>PURPOSE:To manufacture a laminate with little dimension variation by laminating the given number of prepregs manufactured by impregnating a reinforced base with thermosetting resin varnish and drying, laminating copper foils having the specified value of tensile strength under the normal condition and the specified value of tensile strength after heating to the specified temperature and heat and pressure molding. CONSTITUTION:A laminate is formed by laminating the given number of prepregs manufactured by impregnating a reinforced base with thermosetting resin varnish and drying, and copper foils having 40kg/mm<2> or more of tensile strength under the normal condition and 90% of tensile strength at the normal time after heating at 180 deg.C for one hour are laminated and heat and pressure molded. Epoxy resin phenol resin or the like is used as thermosetting resin, and epoxy resin is preferred in order to demonstrate sufficiently the features of high tensile copper foils. The laminate thus manufactured is of superior control of dimension variation generated by mechanical grinding compared with a regular laminate. The dimension variation at the time of forming a circuit, therefore, is small, and the position accuracy at the high density wiring pattern can be upgraded, and processing equivalent to the normal laminate or a composite material can be carried out.</p> |
