| 摘要 |
A device ( 100 ) and a method ( 200 ) for controlling resin bleed, the device comprising a substrate ( 105 ) having a surface ( 107 ), an integrated circuit ( 115 ) having a plurality of leads ( 120 ) extending therefrom, and an adhesive ( 125 ) comprising a plurality of components. The adhesive ( 125 ) generally resides between the surface ( 107 ) of the substrate ( 105 ) and the integrated circuit ( 115 ), wherein the integrated circuit is generally bonded to the substrate. The device ( 100 ) further comprises a plurality of electrically-conductive bonding pads ( 122 ) associated with the surface ( 107 ) of the substrate and a plurality of studs ( 135 ) respectively formed over the plurality of bonding pads. A plurality of leads ( 120 ) are electrically connected to a top surface ( 137 ) of the each respective stud ( 135 ), wherein a height ( 140 ) of each stud is defined between the respective bonding pad ( 122 ) and the top surface of the stud, and wherein the height of the each stud generally prevents one or more of the plurality of components from bleeding onto the top surface thereof.
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