| 摘要 |
Gas switching is used during an etch process to modulate the characteristics of the etch. The etch process comprises a sequence of at least three steps, wherein the sequence is repeated at least once. For example, the first step may result in a high etch rate of oxide ( 108 ) while the second step is a polymer coating steps and the third step results in a low etch rate of oxide and high etch rate of another material ( 114 ) and/or sputtering.
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