发明名称 Illuminated laminar panel hot-pressed from resin prepregs, transparent overlay and structurally-supportive under-protection
摘要 In a layer below the top transparent overlay, light-emitting diodes (8) are embedded into the composite. Planar diode connections are completed through a flat electrically-conductive inlay (12), connected to a voltage source. An Independent claim is included for the method of making the panel, by assembly and hot pressing, during which operation connections are completed by soldering.
申请公布号 DE19811076(A1) 申请公布日期 1999.09.16
申请号 DE1998111076 申请日期 1998.03.13
申请人 CUERTEN, ACHIM 发明人 CUERTEN, ACHIM
分类号 B32B3/08;B32B29/02;B32B37/18;B44C5/04;F21K99/00;F21S2/00;F21S8/00;F21V23/00;H05K1/18 主分类号 B32B3/08
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