| 摘要 |
An EL module capable of improving its quality and reducing its production cost and comprising a circuit board (1) and an EL element (2) bonded together, wherein the connection electrodes (3a, 3b) of the board and the element are arranged to face each other at the opposite sides of the EL element (2) and adapted to provide electrical connections as well as physical bonds, whereby an allowance in space is made available. Soft insulation resin layers (10a, 10b) are respectively provided between a transparent electrode layer (4a) and a conduction layer (11) at the connection electrode (3a) in conduction with the transparent electrode layer (4a), and between the transparent electrode layer (4a) and a rear electrode layer (7) at the connection electrode (3b) in conduction with the rear electrode layer (7).
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