| 摘要 |
<p>A method and a device for cleaving a semiconductor wafer for providing an ideal vertical cleavage surface of a semiconductor wafer, wherein a semiconductor wafer (1) having scribe streaks (2) cut in the surface thereof is set on support members (6a, 6b) with the support members (6a, 6b) arranged laterally symmetrical with respect to a scribe streak (2) and in parallel to each other, and support members (4a, 4b) are similarly disposed on the upper side of the semiconductor wafer (1) laterally symmetrical with respect to the scribe streak (2) and in parallel to each other, with the support members (4a, 4b) disposed on the outer sides of the support members (6a, 6b). Loads are applied from the side of support members (4a, 4b) to allow respective fulcrum forces to act on the semiconductor wafer (1) from respective support members (4a, 4b, 6a, 6b). A shearing force in the area of the semiconductor wafer (1) between the support members (6a, 6b) is zero and the wafer (1) is cleaved by allowing a maximum principal stress of bending tension to act in a direction perpendicular to the vertical surface of the scribe streak (2).</p> |
