发明名称 Memory cell arrangement
摘要 The arrangement has a semiconductor substrate (2). MOS transistors with a floating gate electrode and a control gate electrode are provided as memory cells in the substrate. Each floating gate electrode (9) is arranged in a groove (7) in a main surface (1) of the substrate. The grooves are bounded by one source/drain region of the MOS transistor. The control gate electrode extends over the gate electrode on the side furthest from the source/drain region. At least part of a channel region of the MOS transistor, between the grooves and a second source/drain region of the MOS transistor, is bounded by the main surface. The control gate electrode is arranged above the part of the channel region bounded by the main surface.
申请公布号 DE19811080(A1) 申请公布日期 1999.09.16
申请号 DE19981011080 申请日期 1998.03.13
申请人 SIEMENS AG 发明人 HOFMANN, FRANZ;WILLER, JOSEF;KRAUTSCHNEIDER, WOLFGANG
分类号 H01L21/336;H01L29/423;H01L29/788;(IPC1-7):H01L27/115;H01L21/824 主分类号 H01L21/336
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