| 摘要 |
A retainer ring for a polishing head is provided to form a resin unit which serves as a contact side to the polishing pad, and to form flow paths for the slurry between adjacent resin blocks and a lower surface of a base unit so as to polish a wafer uniformly and to prevent damage to the wafer. A retainer ring(9) for a polishing head is pressed against a rotating polishing pad and polished while supplying slurry, and is supported by the polishing head to surround a circumference of a wafer. The retainer ring has a base unit(9A) made of a highly rigid material, formed to have a ring-like shape, and supported on the polishing head side, a resin unit(9B) in which a plurality of resin blocks(9b) are fixed to the lower surface of the base unit at regular intervals, and which serves as a contact side to the polishing pad, and flow passages(18) for the slurry constituted by spaces between adjacent resin blocks and the lower surface of the base unit. A plurality of recessed parts or cylindrical recessed parts are formed at a lower surface of the base unit.
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