| 摘要 |
A negative light-sensitive resin composition contains (a) a film-forming polymer; (b) an unsaturated compound with an ethylenic double bond capable of free radical polymerization; (c) a photopolymerization initiator; (d) a thermal polymerization inhibitor; and also (e) 0.001-0.3 wt.% polar organic compound (I). A negative light-sensitive resin composition contains (a) a film-forming polymer; (b) an unsaturated compound with an ethylenic double bond capable of free radical polymerization; (c) a photopolymerization initiator; (d) a thermal polymerization inhibitor; and also (e) 0.001-0.3 wt.% polar organic compound of formula (I). X = -OR<2>, -COOH -SO3H, -CONHR<2>, -COR<2>, -SO2NHR<2>, -HNCONHR<2> or -HNCOOR<2>; and R<1>, R<2> = H, (un)substituted, (un)saturated hydrocarbyl with no ethylenic double bond capable of free radical polymerization, (un)substituted alicyclic hydrocarbyl, (un)substituted aromatic hydrocarbyl or heterocyclyl, which may have an ether linkage in the chain; and if X = OH, R<1> is not H or hydrocarbyl. An Independent claim is also included for light-sensitive resin plates with a photocured image produced by selective exposure of a layer of this composition through a mask, development and removal of unexposed areas. |
