发明名称 HEAT-EXPANDABLE MICROCAPSULES AND METHOD OF UTILIZING THE SAME
摘要 <p>Heat-expandable microcapsules produced from acrylonitrile and an N-substituted maleimide as the major polymerizable monomers and other polymerizable monomers comprising a monomer giving a homopolymer having a Tg of 50 to 200 °C and an unsaturated carboxylic acid (or anhydride) having polymerizability; a resin foam made using the same; and a process for producing a foamed resin composite. The microcapsules are less apt to discolor even upon thermal expansion at 200 °C or higher. The resin foam and the foamed resin composite are capable of having a processed surface, e.g., a matte surface giving a bulky feeling.</p>
申请公布号 WO1999046320(P1) 申请公布日期 1999.09.16
申请号 JP1999001156 申请日期 1999.03.10
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