| 摘要 |
<p>The invention concerns a installation for treating wafers (1) made of material serving as microelectronics substrates, comprising: a basin (20) for containing a treating bath (21) and provided with means for holding (22) the wafers capable of receiving at least one wafer of a first size; and prehensile means (27) for grasping each wafer of a first size, to place it in the bath and remove it therefrom. The invention is characterised in that it further comprises a support (10) for receiving at least one wafer (1) of a second size smaller than the first size, said support having a shape such that it can be grasped by the prehensile means (27) and be received by the basin (20) wafer-holding means (22).</p> |
