SQUEEZE APPARATUS FOR SOLDER PASTE PRINTING,申请号KR19960064937-传众专利搜索

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发明名称	SQUEEZE APPARATUS FOR SOLDER PASTE PRINTING
摘要
申请公布号	KR100220328(B1)	申请公布日期	1999.09.15
申请号	KR19960064937	申请日期	1996.12.12
申请人	LG ELECTRONICS INC.	发明人	PARK, JONG-WOOK;YOO, YOUNG-BIN
分类号	H01L21/60;(IPC1-7):H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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