发明名称 |
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD |
摘要 |
A technique for mounting a plurality of electronic parts on one surface of a wiring substrate is provided. A semiconductor device comprises a wiring substrate having connection pads disposed outside a parts mount; a plurality of electronic parts with the first surface having a plurality of electrodes and the second surface fixing; a first underlying insulation layer provided between the connecting pads and the electrodes; a first metal layer formed overlaid on the first underlying insulation layer and providing connections between the connecting pads and the electrodes; a second underlying insulation layer having electrically insulating properties, provided between the respective electrodes of adjacent electronic parts; a second metal layer formed overlaid on the second underlying insulation layer and providing connections between the respective electrodes of adjacent electronic parts; and a first surface insulation layer covering the first metal layer and a second surface insulation layer covering the second metal layer.
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申请公布号 |
US2008230922(A1) |
申请公布日期 |
2008.09.25 |
申请号 |
US20080031924 |
申请日期 |
2008.02.15 |
申请人 |
MOCHIZUKI CHIHIRO;KIKUCHI HIROSHI |
发明人 |
MOCHIZUKI CHIHIRO;KIKUCHI HIROSHI |
分类号 |
H01L23/485;H01L21/58 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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