BUILT-IN TYPE BOBBIN HAVING OVERFLOW BARNING STRUCTURE OF MOLDING RESIN,申请号KR19970010985U-传众专利搜索

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发明名称	BUILT-IN TYPE BOBBIN HAVING OVERFLOW BARNING STRUCTURE OF MOLDING RESIN
摘要
申请公布号	KR200157274(Y1)	申请公布日期	1999.09.15
申请号	KR19970010985U	申请日期	1997.05.17
申请人	LG ELECTRONICS INC.	发明人	LEE, TAE HWAN
分类号	H01F5/02;(IPC1-7):H01F5/02	主分类号	H01F5/02
代理机构		代理人
主权项
地址

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