| 摘要 |
PROBLEM TO BE SOLVED: To form a semiconductor chip which is parallel to the top face of a chip mounting region by positioning at least three casing legs having equal heights, so that the gravity center of the chip agrees with the center of the mounting region at mounting of the chip. SOLUTION: A semiconductor chip 30 is mounted on a flexible printed circuit board 10a with at least three casing legs 90 having equal heights which are positioned, so that the weight center of the chip 30 agrees with the center of a semiconductor chip-mounting region 25. The chip 30 contacts at the bottom to the tops of the legs 30, a liq. epoxy resin is filled in a space between the bottom of the chip 30 and a mounting region 35, the space has the same height as that of the legs 90 having equal heights, hence the resin hardens to form an adhesive layer 40 having precisely identical thickness, thereby forming the chip parallel with respect to the top face of the chip-mounting region. |
