| 摘要 |
A conditioning disk of a CMP pad is provided to decrease generation of secondary pollution or scratch of the pad and a wafer through a plurality of vacuum holes formed in regular distance on an outer circumference of the disk. A conditioning disk of a CMP pad includes a vacuum hole(50) discharging an by-product from an air bubble to outside after separating the by-product form a polishing pad with vacuum suction force in a pad conditioning process. A plurality of vacuum holes is formed on outer circumference of the pad conditioning disk. The center of the pad conditioning disk, a DI water hole(45) is formed to discharge the remained by-product in the air bubble easily.
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