Forming and cleaning semiconductor wafers,申请号GB19990005302-传众专利搜索

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发明名称	Forming and cleaning semiconductor wafers
摘要
申请公布号	GB2335309(A)	申请公布日期	1999.09.15
申请号	GB19990005302	申请日期	1999.03.08
申请人	* NEC CORPORATION	发明人	HIDEAKI * YAGI
分类号	H01L21/304;H01L21/00;H01L21/306;H01L21/44;H01L21/48;(IPC1-7):H01L21/306	主分类号	H01L21/304
代理机构		代理人
主权项
地址

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