发明名称 |
Semiconductor laser package with power monitoring system |
摘要 |
A semiconductor laser package including a plastic resin housing for encapsulating a vertical cavity surface emitting laser. The semiconductor laser package including a mounting base, a surround can and a cap. The cap having integrally formed therein a power monitoring system, such as a photodetector. The vertical cavity surface emitting laser generating an emission along a path. The photodetector optically positioned to receive a portion of the emission. The power monitoring system including a plurality of layers of an amorphous silicon material and/or a germanium material.
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申请公布号 |
US5953355(A) |
申请公布日期 |
1999.09.14 |
申请号 |
US19970829883 |
申请日期 |
1997.04.02 |
申请人 |
MOTOROLA, INC. |
发明人 |
KIELY, PHILIP;LEBBY, MICHAEL S. |
分类号 |
H01S5/00;H01S5/022;H01S5/183;(IPC1-7):H01S3/18;H01S3/19 |
主分类号 |
H01S5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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