发明名称 Semiconductor laser package with power monitoring system
摘要 A semiconductor laser package including a plastic resin housing for encapsulating a vertical cavity surface emitting laser. The semiconductor laser package including a mounting base, a surround can and a cap. The cap having integrally formed therein a power monitoring system, such as a photodetector. The vertical cavity surface emitting laser generating an emission along a path. The photodetector optically positioned to receive a portion of the emission. The power monitoring system including a plurality of layers of an amorphous silicon material and/or a germanium material.
申请公布号 US5953355(A) 申请公布日期 1999.09.14
申请号 US19970829883 申请日期 1997.04.02
申请人 MOTOROLA, INC. 发明人 KIELY, PHILIP;LEBBY, MICHAEL S.
分类号 H01S5/00;H01S5/022;H01S5/183;(IPC1-7):H01S3/18;H01S3/19 主分类号 H01S5/00
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