| 摘要 |
PROBLEM TO BE SOLVED: To reduce surface faults with a flat surface of an aromatic polyamide film by forming the film having a specific heat shrinkage factor and slack amount, thereby utilizing high rigidity and heat resistance. SOLUTION: The aromatic polyamide film has 21 or less of a heat shrinkage factor in a width direction at 210 deg.C. If the factor is less than 28, the film is deformed by a heat in the case of attaching an amorphous silicon thin film, and hence a good film is not obtained. A slack amount of the film at a center is 60 mm in the case of applying a load of 0.5 kg/mm<2> to the film having a width of 610 mm and a length of 2 m. If the slack amount is less than 60 mm, the film is released from a support on the support such as a drum in the case of providing the silicon thin film, the film is deformed by the head or a contact with a guide roll is deteriorated at the time of feeding the film, and hence there occurs a problem in which a damage is formed on the film. The solar cell having the silicon thin film on the polyamide film is flat and has excellent film characteristics. |
