发明名称 LASER PROCESSING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To quicken forming of holes on a print wiring substrate. SOLUTION: A laser light horn a CO2 gas laser 61 is incident on a cylindrical lens 12 via mirrors 62, 63, 64, 65 and 66, and a field lens 67. The cylindrical lens 12 condenses the incident lights in upper and lower directions, and ejects them to a mask 11. Two holes are formed on the mask 11 at a given interval, and the laser lights are ejected in an area containing the holes. The mask 11 allows the laser lights to pass from the holes, and shields others. The laser lights passed through the mask 11 are ejected on a processing face via an expander 69, a galvano scanner 70, and a f-θlens 71, and processes the processing face.</p>
申请公布号 JPH11245070(A) 申请公布日期 1999.09.14
申请号 JP19980049527 申请日期 1998.03.02
申请人 SUMITOMO HEAVY IND LTD 发明人 ISO KEIJI
分类号 B23K26/06;B23K26/00;B23K26/38;B23K101/42;H01S3/00;H05K3/00;H05K3/46;(IPC1-7):B23K26/06 主分类号 B23K26/06
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