HEAT-CONDUCTIVE SILICONE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a heat-conductive material suitable for removing heat from heat-generating electronic parts. SOLUTION: This silicone composition contains (A) 100 pts.wt. of a liquid silicone with a total amount of 500-1,000 pts.wt. of (B) a heat-conductive inorganic filler having >=6 Mohs hardness and >=100 W/m K heat conductivity and (C) a heat-conductive inorganic filler having <=5 Mohs hardness and >=20 W/m K heat conductivity. A mixing weight ratio of the component C/(the component B + the component C)} is 0.05-0.5.