发明名称 |
Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection |
摘要 |
A solder interconnection uses preferably lead-rich balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate. After a solder ball has been formed using standard processes, a ball limiting metal mask is formed using photoresist. A thin cap layer of preferably pure tin is deposited on a surface of the solder balls using a tin aqueous immersion process.
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申请公布号 |
US5953623(A) |
申请公布日期 |
1999.09.14 |
申请号 |
US19970835690 |
申请日期 |
1997.04.10 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BOYKO, CHRISTINA M.;INGRAHAM, ANTHONY P.;MARKOVICH, VOYA R.;RUSSELL, DAVID J. |
分类号 |
H01L21/60;H01L23/485;H05K3/34;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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