摘要 |
The low-voltage, e.g., 2.5-volt, transistors that support the logic operations of a CMOS device are formed to have a thin layer of gate oxide, while the high-voltage, e.g., 3.3 or 5-volt, transistors that support the analog operations of the device are formed to have a thick layer of gate oxide in a cost-effective process flow that requires only one additional masking step over a conventional double-poly CMOS process.
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