| 摘要 |
<p>PROBLEM TO BE SOLVED: To form a via hole of 50μm or less in diameter with a good yield by providing a laser processing device to continuously process a copper foil part and an insulating resin substrate at the same process. SOLUTION: A pulse oscillation type laser oscillator 11 generates an ultraviolet laser light by the control of a control part 21. The ultraviolet laser light is led to a galvano scanner 12 by an optical system. The galvano scanner 12 ejects the ultraviolet laser light in a given direction by the control of the control part 21. The ultraviolet laser light from the galvano scanner is vertically incident on a workpiece 14 by a f-θlens 13, and processes the workpiece 14. An attenuator 19 is connected to an attenuator inserting part 20, and the attenuator inserting part 20 inserts the attenuator 19 into the optical path and removes it. The attenuator 19 attenuates the ultraviolet laser light so as to prevent the processing of the copper foil part of the workpiece.</p> |
