发明名称 Thermal dissipation and EMI shielding structure for notebook computers
摘要 A notebook computer has a lower housing with a keyboard and an upper housing with a display, a central processing unit (CPU), and a conductive plate. The CPU is attached directly to the conductive plate to achieve maximum heat transfer. The conductive plate is exposed to the air outside the notebook computer through air vents in the upper housing. Other heat generating elements in the upper housing are directly attached to thermally isolated islands within the conductive plate to allow each element to maintain a separate operating temperature while still conducting heat out of the notebook computer to the outside air. Additionally, the conductive plate is used as part of an electromagnetic interference enclosure to reduce unwanted radiation from leaving the notebook.
申请公布号 US5953206(A) 申请公布日期 1999.09.14
申请号 US19970951191 申请日期 1997.10.15
申请人 HEWLETT-PACKARD COMPANY 发明人 JONDROW, TIMOTHY J.
分类号 G06F1/16;G06F1/18;G06F1/20;H01L23/36;(IPC1-7):G06F1/20;H05K7/20 主分类号 G06F1/16
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