发明名称 |
Epoxy group-containing silicone resin and compositions based thereon |
摘要 |
There is disclosed a curable resin composition that has an excellent fluidity prior to curing and that cures to form a molding resin that is flexible, highly moisture resistant, and strongly resistant to heat shock, said composition comprising (A) 100 weight parts of a curable resin; and (B) 0.1 to 500 weight parts of an epoxy group-containing silicone resin that has the general formula (R1SiO3/2)a(R2R3SiO2/2)b(SiO4/2)c wherein R1, R2 and R3 each represents a group selected from the group consisting of an epoxy group-containing organic group and a monovalent hydrocarbon group with the proviso that said epoxy group-containing organic groups comprise 0.1 to 40 mole percent of the total silicon-bonded organic groups in said silicone resin (B), a is a positive number, b is zero or a positive number, c is zero or a positive number, b/a has a value of zero to 10, c/(a+b+c) has a value of zero to 0.3 and said silicone resin (B) has a glass-transition temperature of -90 DEG C. to 150 DEG C.
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申请公布号 |
US5952439(A) |
申请公布日期 |
1999.09.14 |
申请号 |
US19940226539 |
申请日期 |
1994.04.12 |
申请人 |
DOW CORNING TORAY SILICONE CO., LTD. |
发明人 |
MORITA, YOSHITSUGU;NAKANISHI, JUNJI;TANAKA, KEN;SARUYAMA, TOSHIO |
分类号 |
C08G59/32;C08G77/14;C08L61/06;C08L63/00;C08L79/08;C08L83/06;C08L101/00;(IPC1-7):C08G77/00;C08L283/00 |
主分类号 |
C08G59/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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