发明名称 Metal forming process
摘要 Atomized metal is deposited metal onto a substrate so as to cause at least partial solidification of the deposited metal; further atomized metal is deposited onto the partially solidified deposited metal on the substrate; and the metal deposited onto the partially solidified deposited metal is allowed to fully solidify on the substrate; the cooling of the further deposited metal, and the composition of the metal and/or of a gas used in the atomization of the further atomized metal being tailored such that volumetric contraction on solidification and cooling of the further deposited metal is compensated for, when the deposited metal has been cooled to ambient temperature, by volumetric expansion in a reaction or phase change in the further deposited metal.
申请公布号 US5952056(A) 申请公布日期 1999.09.14
申请号 US19970823181 申请日期 1997.03.24
申请人 SPRAYFORM HOLDINGS LIMITED 发明人 JORDAN, RICHARD MICHAEL;ROCHE, ALLEN DENNIS
分类号 C23C4/02;C23C4/12;C23C4/18;(IPC1-7):C23C4/08 主分类号 C23C4/02
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