发明名称 Method for manufacturing self-aligned titanium salicide using two two-step rapid thermal annealing steps
摘要 A method of manufacturing self-aligned titanium salicide is provided which includes the steps of forming a LOCOS isolation region on a silicon substrate, forming a titanium layer on the surface of the silicon substrate, performing a first two-step rapid thermal anneal on the silicon substrate in an ambient filled with hydrogen and nitrogen gases to convert the titanium layer into a titanium salicide layer, selectively etching the silicon substrate to remove the titanium layer that has not reacted with the silicon substrate, and performing a second two-step rapid thermal anneal on the silicon substrate in an ambient filled with hydrogen and nitrogen gases. Each of the two-step rapid thermal anneals include a first pre-heat step and a second anneal step.
申请公布号 US5953633(A) 申请公布日期 1999.09.14
申请号 US19970906554 申请日期 1997.08.05
申请人 UTEK SEMICONDUCTOR CORP. 发明人 CHEN, CHUN-CHO;HSU, JUI-LUNG
分类号 H01L21/28;H01L21/285;H01L21/306;H01L21/336;(IPC1-7):H01L21/44 主分类号 H01L21/28
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