Mechanism for marking technical and/or electronic components

摘要

The laser (2) beam is aimed at the technical surface for punctiform material removal. A beam homogenised (3) distributes the beam energy uniformly over the beam cross-section. Behind the homogeniser in the beam path is located a multimirror element (6).The element consists of an array of numerous, individually controllable mirrors switchable between two tilt position. The structure is such that the laser beam is reflected at the element, in dependence of the tilt position, and that an aimed, deflected individual beam emanates from each individual mirror. Independent claims describe the marking process.