| 摘要 |
<p>In the apparatus for and the method of heat-treating a substrate (G), the substrate (G) is prevented from bearing any electrostatic charges without fail. A workpiece-carrying platform (1) for carrying the substrate (G) thereon is divided into: a workpiece-carrying platform body (3) forming a major part of the workpiece-carrying platform (1); and, a lifting/lowering ring plate (4) forming the remaining part of the workpiece-carrying platform (1). The lifting/lowering ring plate (4) is received in a receiving groove (5) of the workpiece-carrying platform body (3) so as to be capable of being lifted and lowered therein. When the substrate (G) is separated from the the workpiece-carrying platform (1), the lifting/lowering ring plate (4) is first lowered, and then the substrate (G) is lifted by lift pins (8) so that the substrate (G) is lifted in two steps, whereby the contact surface of the substrate (G) with workpiece-carrying platform (1) is separated from the latter stepwise. <IMAGE></p> |
