发明名称 |
Semiconductor interconnect structure with air gap for reducing intralayer capacitance in metal layers in damascene metalization process |
摘要 |
An interconnect structure capable of reducing intralevel capacitance in a damascene metalization process employs entrapped air gaps between metal lines. The structure comprises at least first and second metal regions separated by a dielectric region, an air gap formed at least partially within the dielectric region, a diffusion barrier positioned over the two metal regions covering a portion of the upper surface of the air gap, and an insulating layer positioned over the diffusion barrier sealing the upper surface of the air gap.
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申请公布号 |
US5949143(A) |
申请公布日期 |
1999.09.07 |
申请号 |
US19980012006 |
申请日期 |
1998.01.22 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
BANG, DAVID |
分类号 |
H01L21/768;H01L23/522;H01L23/532;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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