| 摘要 |
A system and process for decontaminating solder which includes a linking pipe with an internal heater in the path of solder flow into a skim tank and transfer pump and valves for moving decontaminated solder from the skim tank into a standby tank which in turn is able to provide decontaminated solder to a solder machine or back to the skim tank in order to test the system.
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