Wafer comprising optoelectronic circuits and method of verifying this wafer

摘要

A wafer (10) is described comprising several integrated optoelectronic circuits of a first type (11), such circuits of the first type each comprising electronic modules (13) and at least a first photodiode (14). Said wafer (10) is characterised in that it further comprises at least one integrated optoelectronic circuit of a second type (21) comprising electronic modules (23), at least one second photodiode (24) and at least one bonding pad (25) intended to be connected to an external measuring apparatus, said at least one bonding pad (25) being superposed onto said at least one second photodiode (24) so that said at least one circuit (21) of the second type may be used as a circuit for verifying the manufacturing of said wafer.