| 摘要 |
PCT No. PCT/JP97/00644 Sec. 371 Date Nov. 4, 1997 Sec. 102(e) Date Nov. 4, 1997 PCT Filed Mar. 3, 1997 PCT Pub. No. WO97/33015 PCT Pub. Date Sep. 12, 1997In the present invention, the tin-silver-system alloy plating solution comprising following five fundamental ingredients (a)-(e): (a) a tin compound; (b) a silver compound; (c) at least one member selected from a group consisting of bismuth compounds and copper compounds; (d) a pyrophosphoric compound; and (e) an iodic compound. By the present invention, the tin-silver-system alloy layer, which can be employed instead of tin-lead solder alloy layer, can be formed without using harmful compounds: cyanide, lead compounds, etc..
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