| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method thereof, wherein cracks and blisters are prevented from occurring. SOLUTION: A semiconductor device is equipped with a semiconductor chip 12, a tape 14 mounted with the chip 12, an adhesive resin layer 16 provided between the semiconductor chip 12 and the tape 14, and solder balls 28. The semiconductor device is manufactured through the processes of a first process in which the semiconductor chip 12 is fixed to the tape 14 through the intermediary of the adhesive resin layer 16, a second process in which the solder balls 28 are attached to the tape 14, and a third process in which at least one or more holes 32 are provided penetrating through the tape 14 after the first process. |
