| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip-size semiconductor package which is light-weight, thin, short, and small, and capable of improving a soldered joint in reliability, when it is mounted on a printed circuit board and effectively dissipating heat released from a semiconductor chip, and a manufacturing method thereof. SOLUTION: First leads 33 are each formed on the upper edges of a semiconductor chip 31 equipped with bonding pads, second leads 35 which are each composed of a first part 35a and a second part 35b are provided, the first part 35a is attached to the upper outer edge of the lead 33, and the second part 35b is bent so as to be located above the semiconductor chip 31. The bonding pads and the first leads 33 are connected together electrically with conductive wires 37, and the conductive wires 37 above the semiconductor chip 31, the first leads 33, and the first parts 35a of the second lead 35 are hermetically sealed up for the formation of a chip-size semiconductor package(CSP).</p> |
