| 摘要 |
PROBLEM TO BE SOLVED: To provide a small, thin, and low-cost light-emitting diode chip capable of being mounted directly on the surface of a printed circuit board without through a bonding wire. SOLUTION: This light-emitting diode chip comprises a plurality of chips connected by a conductive material or solder 6 in an orthogonal direction of the P-N junction face at a positive and negative electrode sections 3 and 4 formed on both end faces in parallel with the P-N junction face of the chips, and the electrode 3 and 4 of both ends of the connected sequential chip have a solder coating layer 5 on their surfaces. |
