| 摘要 |
A vertically oriented thermal processor for processing batches of semiconductor wafers held within a processing chamber. The processing chamber is contained within a processing vessel. A furnace liner surrounds the processing vessel in spaced relationship. A first flow of cooling fluid is supplied upwardly between the processing vessel and furnace liner. The incoming first flow also serves to cool the base plate assembly which is constructed to shield the processing chamber from off-gassing. A second flow path of cooling fluid is supplied downwardly between the furnace liner and an inner wall of the furnace heater in countercurrent relationship to the first flow. An outflow baffle and outflow cooler are also advantageously included to isolate the processing chamber and cool the exhausting gases. A preferred power supply system is also described.
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