| 摘要 |
PROBLEM TO BE SOLVED: To provide a small, thin, and low-cost light-emitting diode chip capable of being mounted directly on the surface of a printed circuit board without through a bonding wire. SOLUTION: This light-emitting diode chip can be mounted directly on the surface of a printed circuit board 8 without through a bonding wire. Positive and negative electrodes 3 and 4 formed on both end faces of the chip, in parallel with a P-N junction face and opposing each other have solder coating layers 5 and 6 on their surface. The side face of the chip, the mounting face, facing the printed circuit board 8, has a coating layer of insulation material on its surface. |
